Student Internships

© Fraunhofer USA CCD
© Fraunhofer USA CCD
© Fraunhofer USA CCD

Fraunhofer USA Center for Coatings and Diamond Technologies CCD supports a robust computer science and engineering internship program for both local and international students alike. If you are looking for a rewarding opportunity to gain practical, real-world software engineering experience in an internationally recognized organization, we encourage you to explore our options for your internship experience.

International Student Internships

Fraunhofer USA CCD proudly mentors and trains interns from Germany, Iceland, China and is always looking to expand our intern network. Our interns represent several countries and cultures and are instrumental in completing our business objectives throughout the year. In turn, students receive an unbeatable experience working abroad, near our state’s capitol while immersing themselves in a new social and technological culture. After returning home from these 6 to 12-month programs, students are uniquely positioned to leverage their enhanced skills and global perspectives to further develop their careers.


Undergraduate Student Internships

As a close partner of the Michigan State University (MSU), our internship program is housed on campus, making it ideal for MSU students. Situated in the Engineering Research Complex on MSU's campus and accessible by MSU busses, Fraunhofer USA CCD offers part-time and summer internships as another way to enrich our university community and contribute to the growth of our future industry leaders.


Postdoctoral Research Associate

Fraunhofer USA CCD supports a Postdoctoral Research Associate (PRA) Program for graduate students as they pursue their advanced degrees. The Fraunhofer USA CCD PRA Program provides valuable and relevant research experience and compensation as students work toward their research goals and final requirements.


How to Apply?

If you are interested in joining Fraunhofer USA CCD for a fulfilling internship or graduate research assistantship experience, please e-mail your cover letter, resume, list of publications, and most recent university transcript to