Post-Processing/Microfabrication

Microfabrication

Class 1000 cleanroom facility with 4" wafer processing capabilities

PE-CVD for SiO2 and Si3N4

DC/RF sputtering for metallization

E-beam evaporation for metallization

Photo lithography

Diffusion furnaces

Plasma etching

 

Post-Processing

Metal/ceramic polishing system

Diamond lapping system

Diamond polishing system

Laser for diamond cutting and micromachining

Electron cyclotron resonance plasma etcher

© Photo Fraunhofer CCD